Job
- Level
- Erfahren
- Ort
- Villach
- Arbeitsmodell
- Onsite
- Job Feld
- Application, Embedded
- Anstellung
- Vollzeit
- Vertragsart
- Unbefristetes Dienstverhältnis
Job Zusammenfassung
In dieser Position entwickelst du innovative Simulationsmethoden und Designflüsse in einem HPC-Linux-Umfeld, um die Co-Entwicklung von Chips, Paketen und Boards voranzutreiben und Clusterlösungen zu optimieren.
Job Technologien
Deine Rolle im Team
- Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment.
- Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development.
- Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide.
- Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions.
- Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions.
- Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity.
Unsere Erwartungen an dich
Ausbildung
- Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or a related technical discipline.
Qualifikationen
- Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development.
- Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments.
- Solid knowledge of Linux and one or several of the following programming languages: Python, bash, MATLAB, Perl, skill.
- Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset.
- Fluent English skills are required; German language skills are considered as an advantage.
Erfahrung
- At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields.
- Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms.
- Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation is an advantage.
Unser Angebot
- The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G. The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.
Benefits
Mehr Netto
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- 💰Mitarbeiterprämie
- 💵Bonuszahlungen
- 👴🏻Betr. Altersvorsorge
- 👷♂️Zusatzversicherung
Gesundheit, Fitness & Fun
Work-Life-Integration
Essen & Trinken
Themen mit denen du dich im Job beschäftigst
Job Standorte
Das ist dein Arbeitgeber
Infineon Technologies Austria AG
Villach, Klagenfurt, Graz, Linz
Die Infineon Technologies Austria AG ist ein führender Konzern in Österreich. Neben Deutschland verfügt das Unternehmen hier über hervorragende Forschungs- und Entwicklungskompetenzen sowie Fertigungsmöglichkeiten. Darüber hinaus zeichnet sich die Gesellschaft als zentraler Ansprechpartner bei globalspezifischen Fragen aus.
Description
- Sprachen
- Englisch
- Unternehmenstyp
- Etablierte Firma
- Arbeitsmodell
- Full Remote, Hybrid, Onsite
- Branche
- Industrie, Produktion, Elektronik, Automatisation
Arbeitgeber-Reviews
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(3 Bewertungen)3.0
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