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IC Package / PCB Layout Engineer

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Job

  • Level
    Senior
  • Ort
    Vasoldsberg
  • Arbeitsmodell
    Hybrid, Onsite
  • Job Feld
    Software, Embedded
  • Anstellung
    Vollzeit
  • Vertragsart
    Unbefristetes Dienstverhältnis
  • Gehalt
    ab 75.000 € Brutto/Monat

Job Zusammenfassung

In dieser Position entwirfst du RF- und Hochfrequenz-IC-Layouts für gemischte Signalapplikationen unter Berücksichtigung elektrischer, thermischer undfertigungstechnischer Anforderungen.

Job Technologien

Deine Rolle im Team

  • Design and develop RF and high-frequency IC substrate and PCB layouts for sensor, and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements.
  • Perform RF-aware component placement and transmission line routing, including controlled impedance structures, differential pairs, coplanar waveguides (CPW), microstrip, and stripline implementations.
  • Optimize layout for signal integrity (SI), power integrity (PI), and RF performance, minimizing coupling, crosstalk, insertion loss, return loss, and electromagnetic interference (EMI).
  • Create and maintain package substrate and PCB layouts using Cadence Allegro Suite (Allegro X, APD), Altium Designer and/or Siemens PADS including design libraries, stack-ups, and constraint management.
  • Collaborate with EMC, analog, package, and IC design engineers to support chip-package-board co-design and ensure successful integration of high-frequency circuits and support for simulation activities using SI/PI/EM extraction tools.
  • Perform design verification and manufacturability reviews, including DRC/ERC checks, fabrication rule compliance.
  • Supplier selection and qualification for PCB and SMT (surface mount technology), including supply chain and assembly support.

Unsere Erwartungen an dich

Ausbildung

  • Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field.

Qualifikationen

  • Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit.
  • Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks.
  • Good technical English is a must, German is beneficial.

Erfahrung

  • Minimum of 6 years experience in Semiconductor/Electronic Industry.
  • Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
  • Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable.
  • Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging.
  • CMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design.

Unser Angebot

  • We offer competitive salaries and additional benefits based on your performance, experience and qualification.
  • The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G.
  • We offer a higher compensation depending on your expertise and skills.

Benefits

Gesundheit, Fitness & Fun

Work-Life-Integration

Essen & Trinken

Mehr Netto

Themen mit denen du dich im Job beschäftigst

Job Standorte

  • Standort Vasoldsberg

    8076 Steiermark

    Österreich

Das ist dein Arbeitgeber

ams AG

ams AG

Unsere Sensorsolutions nehmen das Messen auf eine neue Ebene, indem sie eine fließende Schnittstelle zwischen Menschen und Technologie schaffen. Wir ermöglichen unseren Kunden Produkte mit hocheinzigartigen Eigenschaften zu erschaffen – Produkte, die smarter, sicherer, leichter bedienbar und ökologischer sind.

Description

  • Sprachen
    Englisch
  • Unternehmenstyp
    Etablierte Firma
  • Arbeitsmodell
    Hybrid, Onsite
  • Branche
    Elektronik, Automatisation, Handel, Internet, IT, Telekom
Logo ams AG

IC Package / PCB Layout Engineer

Gehalt
ab 75.000 € Brutto/MonatNetto aus dem Bruttogehalt im Inserat umgerechnet.ab 38.277 € netto/Monat
Ort
Vasoldsberg
Arbeitsmodell
Hybrid, Onsite
Diversität
Für alle Personen geeignet (m/w/d)

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